| PART |
Description |
Maker |
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CL31A226MQCLNNC |
Multi Layer Ceramic Capacitor
|
Samsung
|
| DA01 |
CERAMIC MULTI-LAYER AXIAL
|
Dubilier
|
| CL21B103KBANNNC |
Multi Layer Ceramic Capacitor
|
Samsung semiconductor
|
| CTLL1608-FH10NJ CTLL1608-FH10NK CTLL1608-FH12NJ CT |
1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors - Ceramic
1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.062 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Central Technologies / CT Magnetics
|
| CL31B225KOHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31A106KOCLNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| DRU21C102KBTA DRA21C102KBTA DRE21C102KBTA DRU21W10 |
CAPACITORS CERAMIC MULTI-LAYER RADIAL DR
|
Dubilier
|
| CL21B102KBANNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CTLL2012-10NJ CTLL2012-10NK CTLL2012-12NJ CTLL2012 |
Multi-layer Chip Inductors - Ceramic
1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Central Technologies
|
| 2512061017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
| 2512063017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
|
